Junto al Director del Departamento de Electrónica tengo el agrado de invitarle a participar en la conferencia "3D Printed Multi-Functionality and Chip Design for Space", dictada por el profesor Eric MacDonald.
Abstract
Recently, research has focused on 3D printing for not only creating conceptual models but functional end-use
products as well. By democratizing the manufacturing process, products will soon be fabricated locally and
with requirements specified individually by the end user. However, currently 3D printing is generally limited
to single material fabrication and consequently can only create structures such enclosures and conceptual
models. For additively manufactured end-use products to be truly meaningful, additional features and
functionalities will need to be incorporated in to the final structures in terms of electronic, electromechanical,
electromagnetic, thermodynamic, biological, chemical and pharmacological content. In the last decade,
research has been reported of embedding electronic components and electrical interconnect into 3D printed
structures either by interrupting the process or by inserting the additional content after the structure has been
built. However, only until recently and with an investment from the presidential initiative on Additive
Manufacturing has there been a concentrated research focus on developing technology that produces
multi-functionality with an enhanced version of 3D printing, where additional complementary manufacturing
technologies are leveraged with 3D printing. This presentation will describe the research of the Multi3D
Manufacturing System under development at UTEP as well as chip design efforts for Rad Hard electronics to
be embedded within the structures destined for space.
Eric MacDonald's Biography
Eric MacDonald, Ph.D., P.E. is the Texas Instruments Endowed Professor in the Department of Electrical and
Computer Engineering and associate director of the W. M. Keck Center for 3D Innovation at the University of
Texas at El Paso. Dr. MacDonald received his B.S. (1992), M.S. (1997) and Ph.D. (2002) degrees in Electrical
Engineering from the University of Texas at Austin and has held faculty fellowships at NASA’s Jet Propulsion
Laboratory, the Office of Naval Research and a State Department Fulbright Fellowship in Valparaíso, Chile. His
research interests include 3D printed multi-functionality and electronics for low power applications and harsh
environments with over 50 refereed publications and three patents (one of which was licensed by Sony from
IBM). Prior to joining UTEP in 2003, he co-founded Pleiades Design and Test, Inc. - later acquired by Magma
Design Automation, Inc. (Santa Clara, California) and he also worked for both IBM and Freescale
Semiconductor in Austin, Texas as a logic and circuit designer. He is a member of ASEE, senior member of
IEEE and a registered Professional Engineer in Texas.
Publicado en: Charlas
